XCV200-5BG256I
vs
XCV200-5BGG256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-256
BGA,
Pin Count
256
256
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
294 MHz
294 MHz
Combinatorial Delay of a CLB-Max
0.7 ns
0.7 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1176
1176
Number of Equivalent Gates
236666
236666
Number of Inputs
180
180
Number of Logic Cells
5292
Number of Outputs
180
180
Number of Terminals
256
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1176 CLBS, 236666 GATES
1176 CLBS, 236666 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,20X20,50
BGA256,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.55 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
1
1
Temperature Grade
OTHER
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Compare XCV200-5BGG256C with alternatives