XCV150-6FG456C
vs
XCV150-6FGG456I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-456
BGA,
Pin Count
456
456
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
333 MHz
333 MHz
Combinatorial Delay of a CLB-Max
0.6 ns
0.6 ns
JESD-30 Code
S-PBGA-B456
S-PBGA-B456
JESD-609 Code
e0
e1
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
864
864
Number of Equivalent Gates
164674
164674
Number of Inputs
260
260
Number of Logic Cells
3888
Number of Outputs
260
260
Number of Terminals
456
456
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
864 CLBS, 164674 GATES
864 CLBS, 164674 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA456,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
1
1
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