XCV100E-8CSG144I vs XCV100E-6CS144I feature comparison

XCV100E-8CSG144I AMD Xilinx

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XCV100E-6CS144I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description TFBGA, BGA144,13X13,32 CSP-144
Pin Count 144 144
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.47 ns
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Length 12 mm 12 mm
Moisture Sensitivity Level 3 3
Number of CLBs 600 600
Number of Equivalent Gates 32400 32400
Number of Inputs 94 94
Number of Logic Cells 2700 2700
Number of Outputs 94 94
Number of Terminals 144 144
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 600 CLBS, 32400 GATES 600 CLBS, 32400 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA144,13X13,32 BGA144,13X13,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 240
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 12 mm 12 mm
Base Number Matches 1 1
ECCN Code EAR99

Compare XCV100E-8CSG144I with alternatives

Compare XCV100E-6CS144I with alternatives