XCV1000E-8FG680I vs XCV1000E-6FG680C feature comparison

XCV1000E-8FG680I AMD Xilinx

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XCV1000E-6FG680C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-680 FBGA-680
Pin Count 680 680
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 416 MHz 357 MHz
Combinatorial Delay of a CLB-Max 0.4 ns 0.47 ns
JESD-30 Code S-PBGA-B680 S-PBGA-B680
JESD-609 Code e0 e0
Length 40 mm 40 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 331776
Number of Inputs 512 512
Number of Logic Cells 27648 27648
Number of Outputs 512 512
Number of Terminals 680 680
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA680,39X39,40 BGA680,39X39,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.9 mm 1.9 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 40 mm 40 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Temperature Grade OTHER

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