XCV1000E-7FG860C vs XCV1000E-8FGG860C feature comparison

XCV1000E-7FG860C AMD Xilinx

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XCV1000E-8FGG860C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-860 BGA, BGA860,42X42,40
Pin Count 860 860
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 400 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.42 ns 0.4 ns
JESD-30 Code S-PBGA-B860 S-PBGA-B860
JESD-609 Code e0 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 331776
Number of Inputs 660 660
Number of Logic Cells 27648 27648
Number of Outputs 660 660
Number of Terminals 860 860
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA860,42X42,40 BGA860,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code Yes

Compare XCV1000E-7FG860C with alternatives

Compare XCV1000E-8FGG860C with alternatives