XCV1000E-6FGG900I vs XCV1000E-7FGG900C feature comparison

XCV1000E-6FGG900I AMD Xilinx

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XCV1000E-7FGG900C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
parentfamilyid 1613527 1613527
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA900,30X30,40 BGA, BGA900,30X30,40
Pin Count 900 900
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Total Weight 4200 4200
Category CO2 Kg 12.2 12.2
CO2 51240 51240
Compliance Temperature Grade Industrial: -40C to +100C Commercial Extended: +0C to +85C
EU RoHS Version RoHS 2 (2015/863/EU) RoHS 2 (2015/863/EU)
Candidate List Date 2012-12-19 2012-12-19
CAS Accounted for Wt 88 88
CA Prop 65 Presence YES YES
CA Prop 65 CAS Numbers 7440-02-0, 1333-86-4 7440-02-0, 1333-86-4
Conflict Mineral Status DRC Conflict Free Undeterminable DRC Conflict Free Undeterminable
Conflict Mineral Status Source FMD FMD
Clock Frequency-Max 357 MHz 400 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.42 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e1
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 331776
Number of Inputs 660 660
Number of Logic Cells 27648 27648
Number of Outputs 660 660
Number of Terminals 900 900
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 31 mm
Base Number Matches 1 1
Temperature Grade OTHER

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