XCV1000E-6FGG1156I vs XCV1000E-8FGG1156I feature comparison

XCV1000E-6FGG1156I AMD Xilinx

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XCV1000E-8FGG1156I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA, BGA1156,34X34,40 BGA, BGA1156,34X34,40
Pin Count 1156 1156
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 357 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.47 ns 0.4 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 331776 331776
Number of Inputs 660 660
Number of Logic Cells 27648 27648
Number of Outputs 660 660
Number of Terminals 1156 1156
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 6144 CLBS, 331776 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.89 V 1.89 V
Supply Voltage-Min 1.71 V 1.71 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XCV1000E-6FGG1156I with alternatives

Compare XCV1000E-8FGG1156I with alternatives