XCV1000E-6BG560I
vs
XCV1000-4BG560I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-560
BGA-560
Pin Count
560
560
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
357 MHz
250 MHz
Combinatorial Delay of a CLB-Max
0.47 ns
0.8 ns
JESD-30 Code
S-PBGA-B560
S-PBGA-B560
JESD-609 Code
e0
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6144
6144
Number of Equivalent Gates
331776
1124022
Number of Inputs
404
404
Number of Logic Cells
27648
27648
Number of Outputs
404
404
Number of Terminals
560
560
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 331776 GATES
6144 CLBS, 1124022 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA560,33X33,50
BGA560,33X33,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
1.89 V
2.625 V
Supply Voltage-Min
1.71 V
2.375 V
Supply Voltage-Nom
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
1
1
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