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XCV1000-4BG560I vs XCV1000E-8BG560I feature comparison

XCV1000-4BG560I AMD Xilinx

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XCV1000E-8BG560I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-560 BGA-560
Pin Count 560 560
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 416 MHz
Combinatorial Delay of a CLB-Max 0.8 ns 0.4 ns
JESD-30 Code S-PBGA-B560 S-PBGA-B560
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 3 3
Number of CLBs 6144 6144
Number of Equivalent Gates 1124022 331776
Number of Inputs 404 404
Number of Logic Cells 27648 27648
Number of Outputs 404 404
Number of Terminals 560 560
Organization 6144 CLBS, 1124022 GATES 6144 CLBS, 331776 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA560,33X33,50 BGA560,33X33,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 2.625 V 1.89 V
Supply Voltage-Min 2.375 V 1.71 V
Supply Voltage-Nom 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Pbfree Code No
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

Compare XCV1000-4BG560I with alternatives

Compare XCV1000E-8BG560I with alternatives