Findchips: Compare XCV100-6FG256I vs XCV100-4FGG256C

XCV100-6FG256I vs XCV100-4FGG256C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	FBGA-256	BGA,
Pin Count	256	256
Reach Compliance Code	not_compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	333 MHz	250 MHz
Combinatorial Delay of a CLB-Max	0.6 ns	0.8 ns
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e0	e1
Length	17 mm	17 mm
Moisture Sensitivity Level	3	3
Number of CLBs	600	600
Number of Equivalent Gates	108904	108904
Number of Inputs	176	176
Number of Logic Cells	2700
Number of Outputs	176	176
Number of Terminals	256	256
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	600 CLBS, 108904 GATES	600 CLBS, 108904 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	2 mm	2 mm
Supply Voltage-Max	2.625 V	2.625 V
Supply Voltage-Min	2.375 V	2.375 V
Supply Voltage-Nom	2.5 V	2.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Terminal Finish	TIN LEAD	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30
Width	17 mm	17 mm
Base Number Matches	1	1
Pbfree Code		Yes
Temperature Grade		OTHER
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays