XCV100-5FG256I
vs
XC2S100-6FG256C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-256
Pin Count
256
256
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
294 MHz
263 MHz
Combinatorial Delay of a CLB-Max
0.7 ns
0.6 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
600
600
Number of Equivalent Gates
108904
100000
Number of Inputs
176
180
Number of Logic Cells
2700
2700
Number of Outputs
176
176
Number of Terminals
256
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600 CLBS, 108904 GATES
600 CLBS, 100000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max
2.625 V
2.625 V
Supply Voltage-Min
2.375 V
2.375 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
1
1
ECCN Code
EAR99
Factory Lead Time
52 Weeks
Temperature Grade
OTHER
Compare XCV100-5FG256I with alternatives
Compare XC2S100-6FG256C with alternatives