XCS40-3BG256C
vs
XCS30-3BGG256I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-256
|
BGA,
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAXIMUM USABLE GATES 40000
|
|
| Clock Frequency-Max |
125 MHz
|
|
| Combinatorial Delay of a CLB-Max |
1.6 ns
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e1
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
784
|
576
|
| Number of Equivalent Gates |
13000
|
10000
|
| Number of Inputs |
205
|
|
| Number of Logic Cells |
784
|
|
| Number of Outputs |
205
|
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
784 CLBS, 13000 GATES
|
576 CLBS, 10000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,20X20,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.55 mm
|
3.5 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
Compare XCS40-3BG256C with alternatives
Compare XCS30-3BGG256I with alternatives