XCR5032C-10PC44C
vs
PZ5032I10BC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
PLASTIC, LCC-44
|
10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
YES
|
|
| Clock Frequency-Max |
59 MHz
|
59 MHz
|
| In-System Programmable |
YES
|
|
| JESD-30 Code |
S-PQCC-J44
|
S-PQFP-G44
|
| JESD-609 Code |
e0
|
|
| JTAG BST |
YES
|
|
| Length |
16.5862 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
2
|
2
|
| Number of I/O Lines |
32
|
32
|
| Number of Macro Cells |
32
|
|
| Number of Terminals |
44
|
44
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
2 DEDICATED INPUTS, 32 I/O
|
2 DEDICATED INPUTS, 32 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
TQFP
|
| Package Equivalence Code |
QFP44,.5SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
1.2 mm
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
16.5862 mm
|
10 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare XCR5032C-10PC44C with alternatives
Compare PZ5032I10BC with alternatives