XCR3512XL-7FTG256C vs LC5512MV-75F256I feature comparison

XCR3512XL-7FTG256C AMD Xilinx

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LC5512MV-75F256I Lattice Semiconductor Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description FBGA-256 FPBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 12 Weeks
Additional Feature YES YES
Clock Frequency-Max 135 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
JTAG BST YES YES
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 212 193
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 193 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 7.5 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 2 1

Compare XCR3512XL-7FTG256C with alternatives

Compare LC5512MV-75F256I with alternatives