XCR3512XL-12FGG324I
vs
XCR3512XL-12FG324C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-324
FBGA-324
Pin Count
324
324
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
77 MHz
77 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
23 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
260
260
Number of Macro Cells
512
512
Number of Terminals
324
324
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 260 I/O
0 DEDICATED INPUTS, 260 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA324,20X20,40
BGA324,20X20,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.7 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
23 mm
Base Number Matches
2
2
Factory Lead Time
12 Weeks
Compare XCR3512XL-12FGG324I with alternatives
Compare XCR3512XL-12FG324C with alternatives