XCR3384XL-10FG324C vs XCR3384XL-12FGG324C feature comparison

XCR3384XL-10FG324C AMD Xilinx

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XCR3384XL-12FGG324C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-324 FBGA-324
Pin Count 324 324
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 102 MHz 83 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e0 e1
JTAG BST YES YES
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 220 220
Number of Macro Cells 384 384
Number of Terminals 324 324
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 220 I/O 0 DEDICATED INPUTS, 220 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,20X20,40 BGA324,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 2.5 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1

Compare XCR3384XL-10FG324C with alternatives

Compare XCR3384XL-12FGG324C with alternatives