XCR3256XL-12CSG280C
vs
XCR3256XL-10CS280C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
0.80 MM PITCH, LEAD FREE, CSP-280
0.80 MM PITCH, CSP-280
Pin Count
280
280
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
88 MHz
105 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B280
S-PBGA-B280
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
16 mm
16 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
164
164
Number of Macro Cells
256
256
Number of Terminals
280
280
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 164 I/O
0 DEDICATED INPUTS, 164 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA280,19X19,32
BGA280,19X19,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
240
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
16 mm
16 mm
Base Number Matches
1
1
Compare XCR3256XL-12CSG280C with alternatives
Compare XCR3256XL-10CS280C with alternatives