XCR3256XL-12CSG280C vs XCR3256XL-10CS280C feature comparison

XCR3256XL-12CSG280C AMD Xilinx

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XCR3256XL-10CS280C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 0.80 MM PITCH, LEAD FREE, CSP-280 0.80 MM PITCH, CSP-280
Pin Count 280 280
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 88 MHz 105 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B280 S-PBGA-B280
JESD-609 Code e1 e0
JTAG BST YES YES
Length 16 mm 16 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 164 164
Number of Macro Cells 256 256
Number of Terminals 280 280
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 164 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA280,19X19,32 BGA280,19X19,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 240
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16 mm 16 mm
Base Number Matches 1 1

Compare XCR3256XL-12CSG280C with alternatives

Compare XCR3256XL-10CS280C with alternatives