XCR3256XL-10FT256C
vs
M4A3-256/128-6YC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
QFP
Package Description
FBGA-256
PLASTIC, QFP-208
Pin Count
256
208
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
105 MHz
95.2 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
17 mm
28 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
164
128
Number of Macro Cells
256
256
Number of Terminals
256
208
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 164 I/O
0 DEDICATED INPUTS, 128 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA256,16X16,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
10 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
4.1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
28 mm
Base Number Matches
1
1
Compare XCR3256XL-10FT256C with alternatives
Compare M4A3-256/128-6YC with alternatives