XCR3128XL-10VQG100C
vs
EPM7256AEQI208-6
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
End Of Life
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ALTERA CORP
|
| Package Description |
LEAD FREE, VQFP-100
|
FQFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
AMD
|
|
| Additional Feature |
YES
|
|
| Clock Frequency-Max |
95 MHz
|
166.7 MHz
|
| In-System Programmable |
YES
|
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G208
|
| JESD-609 Code |
e3
|
e3
|
| JTAG BST |
YES
|
|
| Length |
14 mm
|
28 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
84
|
164
|
| Number of Macro Cells |
128
|
|
| Number of Terminals |
100
|
208
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
0 DEDICATED INPUTS, 84 I/O
|
0 DEDICATED INPUTS, 164 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
FQFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
6 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
4.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
28 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
208
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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