XCR3064XL-6CS48C vs XCR3064XL-7CS48C feature comparison

XCR3064XL-6CS48C AMD Xilinx

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XCR3064XL-7CS48C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 0.80 MM PITCH, CSP-48 0.80 MM PITCH, CSP-48
Pin Count 48 48
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 192 MHz 119 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B48 S-PBGA-B48
JESD-609 Code e0 e0
JTAG BST YES YES
Length 7 mm 7 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 40 40
Number of Macro Cells 64 64
Number of Terminals 48 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 40 I/O 0 DEDICATED INPUTS, 40 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA48,7X7,32 BGA48,7X7,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 240 240
Programmable Logic Type EE PLD EE PLD
Propagation Delay 6 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 7 mm 7 mm
Base Number Matches 1 1
Factory Lead Time 30 Weeks

Compare XCR3064XL-6CS48C with alternatives

Compare XCR3064XL-7CS48C with alternatives