XCR3064A-10CP56C vs XCR3064XL-7CPG56C feature comparison

XCR3064A-10CP56C AMD Xilinx

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XCR3064XL-7CPG56C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, CHIP SCALE, BGA-56 0.50 MM PITCH, LEAD FREE, CSP-56
Pin Count 56 56
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 83 MHz 119 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B56 S-PBGA-B56
JESD-609 Code e0 e1
JTAG BST YES YES
Length 6 mm 6 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 2
Number of I/O Lines 44 48
Number of Macro Cells 64 64
Number of Terminals 56 56
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2 DEDICATED INPUTS, 44 I/O 0 DEDICATED INPUTS, 48 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA56,10X10,20 BGA56,10X10,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 260
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.35 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 6 mm 6 mm
Base Number Matches 1 1
Pbfree Code Yes
ECCN Code EAR99

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