XCR22LV10-10VO24C
vs
P3Z22V10IBDH
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
TSSOP, TSSOP24,.25
|
4.40 MM, PLASTIC, SOT-355-1, TSSOP-24
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Architecture |
PAL-TYPE
|
|
| Clock Frequency-Max |
125 MHz
|
65 MHz
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
|
| Length |
7.8 mm
|
7.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Dedicated Inputs |
11
|
11
|
| Number of I/O Lines |
10
|
10
|
| Number of Inputs |
22
|
|
| Number of Outputs |
10
|
|
| Number of Product Terms |
132
|
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
11 DEDICATED INPUTS, 10 I/O
|
11 DEDICATED INPUTS, 10 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP24,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
15 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare XCR22LV10-10VO24C with alternatives
Compare P3Z22V10IBDH with alternatives