XCKU5P-L1FFVA676I vs XCKU5P-L1SFVB784I feature comparison

XCKU5P-L1FFVA676I AMD Xilinx

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XCKU5P-L1SFVB784I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA, BGA676,26X26,40
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2016-06-03 2016-06-03
JESD-30 Code S-PBGA-B676 S-PBGA-B784
JESD-609 Code e1 e1
Length 27 mm 23 mm
Moisture Sensitivity Level 4 4
Number of CLBs 27120 27120
Number of Inputs 304 304
Number of Logic Cells 474600 474600
Number of Outputs 304 304
Number of Terminals 676 784
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 27120 CLBS 27120 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA676,26X26,40 BGA784,28X28,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.52 mm 3.32 mm
Supply Voltage-Max 0.742 V 0.742 V
Supply Voltage-Min 0.698 V 0.698 V
Supply Voltage-Nom 0.72 V 0.72 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 23 mm
Base Number Matches 2 2
Factory Lead Time 52 Weeks
Additional Feature IT ALSO OPERATES AT 0.85 V
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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Compare XCKU5P-L1SFVB784I with alternatives