XCKU15P-2LFFVE1760E vs XCKU15P-L2FFVA1760E feature comparison

XCKU15P-2LFFVE1760E AMD

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XCKU15P-L2FFVA1760E AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Reach Compliance Code compliant compliant
JESD-609 Code e1 e1
Moisture Sensitivity Level 4 4
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 2
Package Description BGA, BGA1760,42X42,40
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01
Date Of Intro 2016-06-03
Additional Feature ALSO OPERATES AT 0.85V NOMINAL SUPPLY
JESD-30 Code S-PBGA-B1760
Length 42.5 mm
Number of CLBs 65340
Number of Inputs 668
Number of Logic Cells 1143450
Number of Outputs 668
Number of Terminals 1760
Operating Temperature-Max 110 °C
Operating Temperature-Min
Organization 65340 CLBs
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Seated Height-Max 3.71 mm
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Surface Mount YES
Temperature Grade OTHER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm

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