XCF04SVOG20CES
vs
AT17F040-30CL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
ATMEL CORP
Part Package Code
TSSOP
SOIC
Package Description
TSSOP,
SON,
Pin Count
20
8
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.1.B.1
3A991.B.1.B.1
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
R-PDSO-G20
S-XDSO-N8
JESD-609 Code
e3
e4
Length
6.5024 mm
5.99 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
CONFIGURATION MEMORY
CONFIGURATION MEMORY
Memory Width
1
1
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
20
8
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4MX1
4MX1
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
SON
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.19 mm
1.14 mm
Supply Voltage-Max (Vsup)
3.6 V
3.63 V
Supply Voltage-Min (Vsup)
3 V
2.97 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Copper/Nickel/Gold (Cu/Ni/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.99 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
33 MHz
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Write Cycle Time-Max (tWC)
0.03 ms
Compare XCF04SVOG20CES with alternatives
Compare AT17F040-30CL with alternatives