XC9536XV-3CSG48I vs XC9536XV-4CSG48C feature comparison

XC9536XV-3CSG48I AMD Xilinx

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XC9536XV-4CSG48C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA, PLASTIC, CSP-48
Pin Count 48 48
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B48 S-PBGA-B48
JESD-609 Code e1 e1
Length 7 mm 7 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 36 36
Number of Terminals 48 48
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 36 I/O 0 DEDICATED INPUTS, 36 I/O
Output Function REGISTERED MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 3.5 ns 4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Max 2.6 V 2.62 V
Supply Voltage-Min 2.4 V 2.37 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 7 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare XC9536XV-3CSG48I with alternatives

Compare XC9536XV-4CSG48C with alternatives