XC95288XL-10FG256C
vs
XC95288XL-7FG256C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
XILINX INC
Package Description
PLASTIC, FBGA-256
PLASTIC, FBGA-256
Reach Compliance Code
not_compliant
not_compliant
Samacsys Manufacturer
AMD
Additional Feature
YES
YES
Clock Frequency-Max
100 MHz
125 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
192
192
Number of Inputs
192
192
Number of Macro Cells
288
288
Number of Outputs
192
192
Number of Terminals
256
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 192 I/O
0 DEDICATED INPUTS, 192 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
10 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
256
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
52 Weeks
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