XC95288-20BG352I
vs
XC95216-20BG352I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-352
BGA-352
Pin Count
352
352
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
50 MHz
50 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e0
JTAG BST
YES
YES
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
192
166
Number of Macro Cells
288
216
Number of Terminals
352
352
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
0 DEDICATED INPUTS, 192 I/O
0 DEDICATED INPUTS, 166 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.4 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Compare XC95288-20BG352I with alternatives
Compare XC95216-20BG352I with alternatives