XC95288-10BGG352C vs XC95288-15BG352C feature comparison

XC95288-10BGG352C AMD Xilinx

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XC95288-15BG352C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LBGA, BGA-352
Pin Count 352 352
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 67 MHz 55.6 MHz
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 192 192
Number of Terminals 352 352
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 192 I/O 0 DEDICATED INPUTS, 192 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 10 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Additional Feature YES
In-System Programmable YES
JTAG BST YES
Number of Macro Cells 288

Compare XC95288-10BGG352C with alternatives

Compare XC95288-15BG352C with alternatives