XC95216-10BG352C
vs
XC95216-10BGG352I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
BGA-352
LBGA,
Pin Count
352
352
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max
66.7 MHz
66.7 MHz
In-System Programmable
YES
JESD-30 Code
S-PBGA-B352
S-PBGA-B352
JESD-609 Code
e0
e1
JTAG BST
YES
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
166
166
Number of Macro Cells
216
Number of Terminals
352
352
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 166 I/O
0 DEDICATED INPUTS, 166 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA352,26X26,50
BGA352,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
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