XC95144XV-5CSG144C
vs
XA95144XL-10CSG144I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
BGA
|
|
Package Description |
TFBGA, BGA144,13X13,32
|
CSP-144
|
Pin Count |
144
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
222.2 MHz
|
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
JESD-609 Code |
e1
|
e1
|
JTAG BST |
YES
|
YES
|
Length |
12 mm
|
12 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
117
|
117
|
Number of Macro Cells |
144
|
144
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
0 DEDICATED INPUTS, 117 I/O
|
0 DEDICATED INPUTS, 117 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA144,13X13,32
|
BGA144,13X13,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
Propagation Delay |
5 ns
|
10 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
2.62 V
|
3.6 V
|
Supply Voltage-Min |
2.37 V
|
3 V
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
2
|
Screening Level |
|
AEC-Q100
|
|
|
|
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