XC95144XL-5CSG144C
vs
XC95144XV-7CS144I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
LEAD FREE, CSP-144
CSP-144
Pin Count
144
144
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
52 Weeks
Additional Feature
YES
YES
Clock Frequency-Max
138.88 MHz
125 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
12 mm
12 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
117
117
Number of Inputs
117
Number of Macro Cells
144
144
Number of Outputs
117
Number of Terminals
144
144
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 117 I/O
0 DEDICATED INPUTS, 117 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA144,13X13,32
BGA144,13X13,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
240
Programmable Logic Type
FLASH PLD
FLASH PLD
Propagation Delay
5 ns
7.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max
3.6 V
2.62 V
Supply Voltage-Min
3 V
2.37 V
Supply Voltage-Nom
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
12 mm
12 mm
Base Number Matches
1
1
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