XC912DT128AVPV vs MC912DG128AVPVE feature comparison

XC912DT128AVPV Motorola Semiconductor Products

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MC912DG128AVPVE NXP Semiconductors

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Package Description LQFP, TQFP-112
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 16 16
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G112 S-PQFP-G112
Length 20 mm 20 mm
Number of I/O Lines 83 83
Number of Terminals 112 112
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 8 MHz 8 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS HCMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2
Rohs Code Yes
ECCN Code EAR99
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Boundary Scan NO
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Peak Reflow Temperature (Cel) 260
ROM (words) 131072
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC912DG128AVPVE with alternatives