XC912DT128AVPV
vs
MC912DG128AVPVE
feature comparison
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
LQFP,
|
TQFP-112
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
16 MHz
|
16 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G112
|
S-PQFP-G112
|
Length |
20 mm
|
20 mm
|
Number of I/O Lines |
83
|
83
|
Number of Terminals |
112
|
112
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
LQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
20 mm
|
20 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
13 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Boundary Scan |
|
NO
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
3
|
On Chip Program ROM Width |
|
8
|
Peak Reflow Temperature (Cel) |
|
260
|
ROM (words) |
|
131072
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare XC912DT128AVPV with alternatives
Compare MC912DG128AVPVE with alternatives