XC7Z010-2CLG400Q
vs
XC7Z010-2CLG400E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
3
|
3
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
LFBGA,
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
65 Weeks
|
| JESD-30 Code |
|
S-PBGA-B400
|
| Length |
|
17 mm
|
| Number of Terminals |
|
400
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Equivalence Code |
|
BGA400,20X20,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Voltage-Max |
|
1.05 V
|
| Supply Voltage-Min |
|
0.95 V
|
| Supply Voltage-Nom |
|
1 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
17 mm
|
| uPs/uCs/Peripheral ICs Type |
|
SoC
|
|
|
|