XC7S25-1CSGA324C vs XC7A25T-1CSG325I feature comparison

XC7S25-1CSGA324C AMD Xilinx

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XC7A25T-1CSG325I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description CSBGA-324
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Date Of Intro 2016-11-15 2016-11-15
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B325
JESD-609 Code e1 e1
Length 15 mm 15 mm
Number of CLBs 1825 1825
Number of Inputs 150 150
Number of Logic Cells 23360 23360
Number of Outputs 150 150
Number of Terminals 324 325
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1825 CLBS 1825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA325,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Technology HKMG
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC7A25T-1CSG325I with alternatives