XC7K70T-1FBV484I
vs
XC7K70T-1FBG484I
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Package Description
BGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.74 ns
0.3 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
23 mm
Number of CLBs
5125
5125
Number of Terminals
484
484
Organization
5125 CLBS
5125 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,22X22,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
2.54 mm
2.54 mm
Supply Voltage-Max
1.03 V
1.03 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
23 mm
23 mm
Base Number Matches
1
2
Factory Lead Time
16 Weeks
Samacsys Manufacturer
AMD
Clock Frequency-Max
1098 MHz
Moisture Sensitivity Level
4
Number of Inputs
285
Number of Logic Cells
65600
Number of Outputs
285
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
30
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