XC7K70T-1FBV484I vs XC7K70T-1FBG484I feature comparison

XC7K70T-1FBV484I AMD Xilinx

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XC7K70T-1FBG484I AMD

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Package Description BGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.74 ns 0.3 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 23 mm 23 mm
Number of CLBs 5125 5125
Number of Terminals 484 484
Organization 5125 CLBS 5125 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.54 mm 2.54 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 1 2
Factory Lead Time 16 Weeks
Samacsys Manufacturer AMD
Clock Frequency-Max 1098 MHz
Moisture Sensitivity Level 4
Number of Inputs 285
Number of Logic Cells 65600
Number of Outputs 285
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified
Technology CMOS
Time@Peak Reflow Temperature-Max (s) 30

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