XC7K410T-2FFG900C vs XC7K410T-2FF900C feature comparison

XC7K410T-2FFG900C AMD Xilinx

Buy Now Datasheet

XC7K410T-2FF900C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Pin Count 900
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1286 MHz 1818 MHz
Combinatorial Delay of a CLB-Max 0.61 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 31775
Number of Inputs 500 500
Number of Logic Cells 406720 406720
Number of Outputs 500 500
Number of Terminals 900 900
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 31775 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.35 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm
Base Number Matches 1 1
Factory Lead Time 65 Weeks

Compare XC7K410T-2FFG900C with alternatives

Compare XC7K410T-2FF900C with alternatives