XC7K410T-2FFG900C
vs
XC7K410T-2FF900C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
Pin Count
900
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1286 MHz
1818 MHz
Combinatorial Delay of a CLB-Max
0.61 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e1
e0
Length
31 mm
Moisture Sensitivity Level
4
4
Number of CLBs
31775
Number of Inputs
500
500
Number of Logic Cells
406720
406720
Number of Outputs
500
500
Number of Terminals
900
900
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
31775 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.35 mm
Supply Voltage-Max
1.03 V
Supply Voltage-Min
0.97 V
Supply Voltage-Nom
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
Base Number Matches
1
1
Factory Lead Time
65 Weeks
Compare XC7K410T-2FFG900C with alternatives
Compare XC7K410T-2FF900C with alternatives