XC7K410T-2FBV900C vs XC7K410T-2FF900I feature comparison

XC7K410T-2FBV900C AMD Xilinx

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XC7K410T-2FF900I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA, 31 X 31 MM, 1 MM PITCH, PLASTIC, FBGA-900
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e1 e0
Length 31 mm 31 mm
Number of CLBs 31775 31775
Number of Inputs 500 500
Number of Outputs 500 500
Number of Terminals 900 900
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 31775 CLBS 31775 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.54 mm 3.35 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 31 mm 31 mm
Base Number Matches 1 2
Part Package Code BGA
Pin Count 900
Clock Frequency-Max 1818 MHz
Number of Logic Cells 406720
Qualification Status Not Qualified
Technology CMOS

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