XC7K325T-1FFG676E
vs
XC7K325T-1FFG676CES
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
LEAD FREE, FBGA-676
27 X 27 MM, 1 MM PITCH, LEAD FREE, FCBGA-676
Pin Count
676
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.74 ns
0.3 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e1
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
4
4
Number of Terminals
676
676
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
3.37 mm
2.54 mm
Supply Voltage-Max
1.03 V
1.03 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
2
2
Clock Frequency-Max
1818 MHz
Number of Inputs
400
Number of Outputs
400
Organization
25475 CLBS
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