XC7K325T-1FF900C
vs
XC7K325T-1FF900I
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1818 MHz
1818 MHz
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e0
e0
Moisture Sensitivity Level
4
Number of Inputs
500
500
Number of Logic Cells
326080
326080
Number of Outputs
500
500
Number of Terminals
900
900
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
2
Pbfree Code
No
Part Package Code
BGA
Package Description
31 X 31 MM, 1 MM PITCH, FBGA-900
Pin Count
900
Combinatorial Delay of a CLB-Max
0.74 ns
Length
31 mm
Number of CLBs
326080
Organization
326080 CLBS
Seated Height-Max
3.35 mm
Supply Voltage-Max
1.03 V
Supply Voltage-Min
0.97 V
Supply Voltage-Nom
1 V
Width
31 mm
Compare XC7K325T-1FF900C with alternatives
Compare XC7K325T-1FF900I with alternatives