XC7K325T-1FF900C vs XC7K325T-1FF900I feature comparison

XC7K325T-1FF900C AMD Xilinx

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XC7K325T-1FF900I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1818 MHz 1818 MHz
JESD-30 Code S-PBGA-B900 S-PBGA-B900
JESD-609 Code e0 e0
Moisture Sensitivity Level 4
Number of Inputs 500 500
Number of Logic Cells 326080 326080
Number of Outputs 500 500
Number of Terminals 900 900
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Package Description 31 X 31 MM, 1 MM PITCH, FBGA-900
Pin Count 900
Combinatorial Delay of a CLB-Max 0.74 ns
Length 31 mm
Number of CLBs 326080
Organization 326080 CLBS
Seated Height-Max 3.35 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Width 31 mm

Compare XC7K325T-1FF900C with alternatives

Compare XC7K325T-1FF900I with alternatives