XC7K325T-1FBV676I
vs
XC7K325T-1FFG676C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Package Description |
BGA,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Combinatorial Delay of a CLB-Max |
0.74 ns
|
0.74 ns
|
JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
JESD-609 Code |
e1
|
e1
|
Length |
27 mm
|
27 mm
|
Number of CLBs |
25475
|
25475
|
Number of Inputs |
400
|
400
|
Number of Outputs |
400
|
400
|
Number of Terminals |
676
|
676
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
25475 CLBS
|
25475 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
2.54 mm
|
3.37 mm
|
Supply Voltage-Max |
1.03 V
|
1.03 V
|
Supply Voltage-Min |
0.97 V
|
0.97 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
676
|
Factory Lead Time |
|
65 Weeks
|
Clock Frequency-Max |
|
1098 MHz
|
Moisture Sensitivity Level |
|
4
|
Number of Logic Cells |
|
326080
|
Peak Reflow Temperature (Cel) |
|
250
|
Qualification Status |
|
Not Qualified
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare XC7K325T-1FBV676I with alternatives
Compare XC7K325T-1FFG676C with alternatives