XC7K325T-1FBG900C
vs
XC7K325T-1FFG900E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Pin Count
900
900
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1098 MHz
Combinatorial Delay of a CLB-Max
0.74 ns
0.74 ns
JESD-30 Code
S-PBGA-B900
S-PBGA-B900
JESD-609 Code
e1
e1
Length
31 mm
31 mm
Moisture Sensitivity Level
4
4
Number of CLBs
25475
Number of Inputs
500
Number of Logic Cells
326080
Number of Outputs
500
Number of Terminals
900
900
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
Organization
25475 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA900,30X30,40
BGA900,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.54 mm
3.35 mm
Supply Voltage-Max
1.03 V
1.03 V
Supply Voltage-Min
0.97 V
0.97 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
31 mm
31 mm
Base Number Matches
2
2
Package Description
LEAD FREE, FBGA-900
Compare XC7K325T-1FBG900C with alternatives
Compare XC7K325T-1FFG900E with alternatives