XC7K160T-2FFG676I vs XC7K160T-2FF676I feature comparison

XC7K160T-2FFG676I AMD Xilinx

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XC7K160T-2FF676I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Pin Count 676
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1286 MHz 1818 MHz
Combinatorial Delay of a CLB-Max 0.61 ns 0.61 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 12675 12675
Number of Inputs 400 400
Number of Logic Cells 162240 162240
Number of Outputs 400 400
Number of Terminals 676 676
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 12675 CLBS 12675 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.37 mm 3.37 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 27 mm 27 mm
Base Number Matches 1 1
Package Description FCBGA-676

Compare XC7K160T-2FFG676I with alternatives

Compare XC7K160T-2FF676I with alternatives