Findchips: Compare XC7K160T-2FBV676C vs XC7K160T-2FFG676I

XC7K160T-2FBV676C vs XC7K160T-2FFG676I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Package Description	BGA,
Reach Compliance Code	compliant	compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.61 ns	0.61 ns
JESD-30 Code	S-PBGA-B676	S-PBGA-B676
JESD-609 Code	e1	e1
Length	27 mm	27 mm
Number of CLBs	12675	12675
Number of Inputs	400	400
Number of Outputs	400	400
Number of Terminals	676	676
Operating Temperature-Max	85 °C	100 °C
Operating Temperature-Min		-40 °C
Organization	12675 CLBS	12675 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA676,26X26,40	BGA676,26X26,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	2.54 mm	3.37 mm
Supply Voltage-Max	1.03 V	1.03 V
Supply Voltage-Min	0.97 V	0.97 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Temperature Grade	OTHER	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	27 mm	27 mm
Base Number Matches	1	1
Pbfree Code		Yes
Part Package Code		BGA
Pin Count		676
Factory Lead Time		65 Weeks
Clock Frequency-Max		1286 MHz
Moisture Sensitivity Level		4
Number of Logic Cells		162240
Peak Reflow Temperature (Cel)		250
Qualification Status		Not Qualified
Technology		CMOS
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays