XC7A200T-2FFV1156I
vs
XC7A200T-2FFV1156C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Package Description |
FBGA-1156
|
FBGA-1156
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Combinatorial Delay of a CLB-Max |
1.05 ns
|
1.05 ns
|
JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1156
|
JESD-609 Code |
e1
|
e1
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
|
Number of CLBs |
16825
|
16825
|
Number of Terminals |
1156
|
1156
|
Organization |
16825 CLBS
|
16825 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1156,34X34,40
|
BGA1156,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.1 mm
|
3.1 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare XC7A200T-2FFV1156I with alternatives
Compare XC7A200T-2FFV1156C with alternatives