XC7A200T-2FFV1156I vs XC7A200T-2FFV1156C feature comparison

XC7A200T-2FFV1156I AMD Xilinx

Buy Now Datasheet

XC7A200T-2FFV1156C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description FBGA-1156 FBGA-1156
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 1.05 ns 1.05 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e1 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4
Number of CLBs 16825 16825
Number of Terminals 1156 1156
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.1 mm 3.1 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 35 mm 35 mm
Base Number Matches 1 1
Operating Temperature-Max 85 °C
Operating Temperature-Min
Temperature Grade OTHER

Compare XC7A200T-2FFV1156I with alternatives

Compare XC7A200T-2FFV1156C with alternatives