XC7A200T-1SBV484I vs XC7A200T-1FBG484C feature comparison

XC7A200T-1SBV484I AMD Xilinx

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XC7A200T-1FBG484C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description FBGA-484
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 19 mm 23 mm
Number of CLBs 16825 16825
Number of Inputs 285 285
Number of Outputs 285 285
Number of Terminals 484 484
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA BGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.54 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 23 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 484
Factory Lead Time 65 Weeks
Clock Frequency-Max 1098 MHz
Moisture Sensitivity Level 4
Number of Logic Cells 215360
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified
Technology CMOS
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) 30

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Compare XC7A200T-1FBG484C with alternatives