XC73108-7WB225C vs XC73108-20BG225I feature comparison

XC73108-7WB225C AMD Xilinx

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XC73108-20BG225I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description WBGA, BGA225,15X15 PLASTIC, BGA-225
Pin Count 225 225
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS
Clock Frequency-Max 83.3 MHz 35.7 MHz
In-System Programmable NO NO
JESD-30 Code S-CBGA-B225 S-PBGA-B225
JTAG BST NO NO
Moisture Sensitivity Level 1 3
Number of Dedicated Inputs 12 12
Number of I/O Lines 78 78
Number of Macro Cells 108 108
Number of Terminals 225 225
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 12 DEDICATED INPUTS, 78 I/O 12 DEDICATED INPUTS, 78 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WBGA BGA
Package Equivalence Code BGA225,15X15 BGA225,15X15
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, WINDOW GRID ARRAY
Programmable Logic Type UV PLD OT PLD
Propagation Delay 18 ns 45 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1.5 mm 1.5 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 1
JESD-609 Code e0
Length 27 mm
Peak Reflow Temperature (Cel) 225
Seated Height-Max 3.5 mm
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

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