XC73108-20PC84C vs XC73108-20PC84I feature comparison

XC73108-20PC84C AMD Xilinx

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XC73108-20PC84I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC LCC
Package Description PLASTIC, LCC-84 PLASTIC, LCC-84
Pin Count 84 84
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS 108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS
Clock Frequency-Max 35.7 MHz 35.7 MHz
In-System Programmable NO NO
JESD-30 Code S-PQCC-J84 S-PQCC-J84
JESD-609 Code e0 e0
JTAG BST NO NO
Length 29.3116 mm 29.3116 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 12 12
Number of I/O Lines 37 37
Number of Macro Cells 108 108
Number of Terminals 84 84
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 12 DEDICATED INPUTS, 37 I/O 12 DEDICATED INPUTS, 37 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC84,1.2SQ LDCC84,1.2SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type OT PLD OT PLD
Propagation Delay 45 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 29.3116 mm 29.3116 mm
Base Number Matches 1 1

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