Findchips: Compare XC6VSX475T-L1FFG1156C vs XC6VSX475T-2FF1156E

XC6VSX475T-L1FFG1156C vs XC6VSX475T-2FF1156E feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	ADVANCED MICRO DEVICES INC	XILINX INC
Package Description	35 X 35 MM, LEAD FREE, FBGA-1156	FBGA-1156
Reach Compliance Code	compliant	not_compliant
Clock Frequency-Max	1098 MHz	1286 MHz
Combinatorial Delay of a CLB-Max	5.87 ns
JESD-30 Code	S-PBGA-B1156	S-PBGA-B1156
JESD-609 Code	e1	e0
Length	35 mm	35 mm
Moisture Sensitivity Level	4	4
Number of Inputs	600	600
Number of Logic Cells	476160	476160
Number of Outputs	600	600
Number of Terminals	1156	1156
Operating Temperature-Max	85 °C
Operating Temperature-Min
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1156,34X34,40	BGA1156,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245	225
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm	3.5 mm
Supply Voltage-Max	0.93 V	1.05 V
Supply Voltage-Min	0.87 V	0.95 V
Supply Voltage-Nom	0.9 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	OTHER
Terminal Finish	TIN SILVER COPPER	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm	35 mm
Base Number Matches	2	2
Part Package Code		BGA
Pin Count		1156
ECCN Code		3A991.D
HTS Code		8542.39.00.01
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays