Findchips: Compare XC6VLX760-L1FFG1760I vs XC6VLX760-L1FFG1760C

XC6VLX760-L1FFG1760I vs XC6VLX760-L1FFG1760C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	ADVANCED MICRO DEVICES INC	ADVANCED MICRO DEVICES INC
Package Description	42.50 X 42.50 MM, LEAD FREE, FBGA-1760	42.50 X 42.50 MM, LEAD FREE, FBGA-1760
Reach Compliance Code	compliant	compliant
Clock Frequency-Max	1098 MHz	1098 MHz
Combinatorial Delay of a CLB-Max	5.87 ns	5.87 ns
JESD-30 Code	S-PBGA-B1760	S-PBGA-B1760
JESD-609 Code	e1	e1
Length	42.5 mm	42.5 mm
Moisture Sensitivity Level	4	4
Number of Inputs	1200	1200
Number of Logic Cells	758784	758784
Number of Outputs	1200	1200
Number of Terminals	1760	1760
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1760,42X42,40	BGA1760,42X42,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.5 mm	3.5 mm
Supply Voltage-Max	0.93 V	0.93 V
Supply Voltage-Min	0.87 V	0.87 V
Supply Voltage-Nom	0.9 V	0.9 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	OTHER
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	42.5 mm	42.5 mm
Base Number Matches	2	2
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays